SanDisk®, a Western Digital brand, has been expanding the possibilities of data storage for more than 25 years—giving businesses and consumers the peace of mind that comes from knowing their data is readily available and reliable, even in the most challenging environments. Our products are used in the world's leading-edge data centers, embedded in game-changing smartphones, tablets, and laptops, and entrusted by consumers around the world. As a vertically-integrated storage solution company, we are able to quickly deliver innovative, high-quality solutions with less time from research to realization. From mobile devices to hyperscale data centers, SanDisk storage solutions make the incredible possible.
In this position the individual will assume responsibility in the area of semiconductor process engineering. The candidate will take responsibility on working directly on new process modules, including materials research, and developing new process integrations schemes for 3D NAND memory technology. Primary job function will focus on utilizing thin film processing techniques such as Chemical Vapor Deposition (CVD), Atomic Layer Deposition/Etching (ALD/ALE), Reactive Ion Etching (RIE), Rapid Thermal Processing (RTP) and Oxidation to fabricate semiconductor memory devices. Process development will also include Research & Development on unique processes and materials. Collecting structural analysis such as SEMs/TEMs and analyzing many forms of process data from experimental splits using statistical analysis software and conducting process optimization using design of experiments (DOE) will be required. Knowledge and experience with Metrology and Optical characterization techniques is also desired. The individual should have some academic knowledge of fundamental device physics and processing that are used in the semiconductor industry (RIE, Lithography, Thin Films, Metrology etc.) so that they can solve process related issues. Interfacing with several engineering departments, including design, integration, and device will occur on a regular basis. Process development will be conducted through local fabs, vendors, and our fabrications facilities in Japan. Short-to-mid stay travel will also be required to our fabs in Yokkaichi, Japan. Responsibility will also include selection of new process equipment used in all areas of wafer fabrication.
This is a New College Graduate (NCG) position seeking a recent PhD graduate with a major in Materials Science & Engineering, Chemical Engineering or equivalent engineering discipline with Semiconductor Fabrication background. The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment, be self-motivated and self-directed, and have demonstrated the ability to work well with people. A proven desire to work as a team member, both on the same team and outside of the team is critical. Ability to troubleshoot and analyze complex problems, ability to multi-task and meet deadlines is required. Excellent communication (written and verbal) and interpersonal skills are a pre-requisite.
Western Digital offers a highly competitive compensation package and great benefits. Western Digital provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, creed, gender, national origin, age, disability, marital or veteran status, sexual orientation, gender identity or expression, or any other legally protected status.